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Shenzhen Shinelinkconn Technology Co.,Ltd.
Shenzhen Xuhuasheng Technology Co., Ltd
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Wire To Board 4.14mm CONN Header Wafer Connector RA Right Angled Dual Row

Shenzhen Shinelinkconn Technology Co.,Ltd.
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Wire To Board 4.14mm CONN Header Wafer Connector RA Right Angled Dual Row

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Certification : ISO9001, ISO14001, IATF16949

Place of Origin : China

MOQ : 1000 pcs

Supply Ability : 10k daily capacity

Delivery Time : 2 weeks

Packaging Details : tube

plastic material : PA6T

contact material : brass, phosphor bronze

current rated : 9A

voltage rated : 600V

plating : tin or gold plated

temperature range : -40-+105 degree

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4.14mm CONN header wafer RA right angled dual row PA6T wire to board conn white 1-770974-0

Specifications:
Material And Finish:
Insulator:Nylon 66 UL94V-0 Color:White
Contact:Brass
Safety Approval: UL


Rating:
Current Rating:9.0 Amp
Voltage Rating:500V AC/DC
Operating Temperature Range:-25°~+85°C


Electrical:
Contact resistance:20m Ohm Max
Insulator resistance:1000M ohm min.
Withstanding Voltage:1000V AC/Minute

Wire To Board 4.14mm CONN Header Wafer Connector RA Right Angled Dual Row


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Wire To Board 4.14mm CONN Header Wafer Connector RA Right Angled Dual Row Images

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